ISXIF Lead Free Solder Wire SAC305 , Flux Core 2% +/-

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Sn99.5Ag3.0Cu0.5 with Core Rosin Flux 2.0%

Product Description

  • The ROHS compliance lead free alloy Sn96.5Ag3.0Cu0.5 to replace the traditional leaded solder Sn63Pb37
  • Melting point between 207 °C to 217 °C
  • Low-residue no-clean solder wire. Especially adapted to the requirements in electronics production.
  • The flux stands out by high temperature resistance.
  • High end lead free tin solder, with high percentage of silver content at 3.0%.
  • Available in wire diameter from 0.5mm up to 2.5mm.

 

Datasheet of Lead Free Solder Wire SAC305

Metal Content Metal Content
Sn 96.5 Ag 3
Cu 0.5 Pb ≤0.10%
Sb ≤0.10% Fe ≤0.02%
Zn ≤0.001% Bi ≤0.10%
Al ≤0.001% As ≤0.03%
Ni ≤0.01% Cd ≤0.01%

 

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