ISXIF Lead Free Solder Wire SAC305 , Flux Core 2% +/-
Sn99.5Ag3.0Cu0.5 with Core Rosin Flux 2.0%
- The ROHS compliance lead free alloy Sn96.5Ag3.0Cu0.5 to replace the traditional leaded solder Sn63Pb37
- Melting point between 207 °C to 217 °C
- Low-residue no-clean solder wire. Especially adapted to the requirements in electronics production.
- The flux stands out by high temperature resistance.
- High end lead free tin solder, with high percentage of silver content at 3.0%.
- Available in wire diameter from 0.5mm up to 2.5mm.
Datasheet of Lead Free Solder Wire SAC305